What is lqfp package

Last updated: April 1, 2026

Quick Answer: LQFP (Low Profile Quad Flat Package) is a surface-mount integrated circuit package with leads on all four sides and a low profile height, commonly used for microcontrollers and semiconductor components in high-density electronic devices.

Key Facts

What is LQFP?

Low Profile Quad Flat Package (LQFP) is a widely-used surface-mount integrated circuit (IC) package design that features leads (pins) on all four sides of a square package with a relatively low height profile. The LQFP design balances functionality, cost, and space efficiency, making it ideal for modern electronic devices where PCB real estate is limited but high pin counts are required. LQFP packages are commonly found in microcontrollers, digital signal processors, and other complex semiconductor components.

LQFP Package Specifications

Dimensions: LQFP packages come in standardized sizes with varying pin counts. Common variants include LQFP-32 (small devices), LQFP-64, LQFP-100, and LQFP-256 (high-pin-count devices). Lead Pitch: Standard LQFP packages have a lead pitch of 0.5 mm, meaning the distance between the center of adjacent pins is 0.5 mm. Height: The low profile design typically measures between 1.4 and 1.6 mm in height, which is significantly lower than older QFP variants, enabling denser PCB layouts and thinner final products.

Advantages of LQFP

The LQFP package offers several advantages over other IC package types. Space Efficiency: The low profile and quad-sided lead configuration allows more components to fit on a PCB while maintaining reasonable spacing. Heat Dissipation: The lead frame and package body provide adequate heat dissipation paths for moderate-power applications. Cost-Effective: LQFP is mature and widely manufactured, making it cost-competitive for high-volume production. Industry Standard: LQFP is universally recognized and supported by design tools, manufacturers, and distributors worldwide.

Common Applications

LQFP packages are extensively used in microcontroller applications including ARM Cortex-M microcontrollers (STM32, NXP LPC series), Atmel AVR devices, and PIC microcontrollers. They are also used in analog-to-digital converters, digital signal processors, small FPGAs, and other complex ICs requiring moderate to high pin counts. Consumer electronics, industrial control systems, automotive electronics, and IoT devices commonly feature LQFP components due to the package's reliability and space efficiency.

Related Questions

What is the difference between QFP and LQFP?

LQFP (Low Profile QFP) has a lower profile height (1.4-1.6 mm) compared to standard QFP packages (2.35+ mm), enabling denser PCB layouts and thinner devices.

Is LQFP easy to solder and assemble?

LQFP requires precision soldering due to its fine 0.5 mm lead pitch, typically using reflow soldering and automated assembly equipment in manufacturing.

What IC packages are alternatives to LQFP?

Alternatives include BGA (Ball Grid Array) for higher pin counts, QFN (Quad Flat No-leads) for improved thermal performance, and TQFP for higher profile variants.

Sources

  1. Wikipedia - Integrated Circuit PackagingCC-BY-SA-4.0